Yu WAMURA

City:

Iwate

Country:

Japan

Published Applications:

Last publication date:

2024-12-05

Top Assignees for applications by Yu WAMURA

The entities that hold a legal rights for patent applications filed by inventor WAMURA Yu:

TOKYO ELECTRON LIMITED 8 Tokyo, Japan
OSAKA UNIVERSITY 1 Osaka, Japan

Recent patent applications by WAMURA Yu

Yu WAMURA from Iwate, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-12-05

US20240401199A1

Chemistry; metallurgy

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

#2 | 2023-07-20

US20230230817A1

Electricity

DEPOSITION METHOD AND DEPOSITION APPARATUS

#3 | 2016-05-19

US20160138158A1

Chemistry; metallurgy

Nozzle and substrate processing apparatus using same

#4 | 2016-04-21

US20160111278A1

Electricity

Substrate processing method and substrate processing apparatus

#5 | 2015-01-29

US20150031204A1

Electricity

Method of depositing film

#6 | 2014-10-02

US20140290578A1

Chemistry; metallurgy

Film deposition apparatus

#7 | 2014-06-26

US20140179122A1

Electricity

Method of depositing a film

#8 | 2014-04-03

US20140094027A1

Electricity

Film forming method and film forming apparatus

#9 | 2010-10-14

US20100260936A1

Electricity

Substrate processing apparatus, substrate processing method, and computer-readable storage medium

InventorID:

712468 ⎘