Inventor profile of:

James Allen Schlueter

City:

Phoenix, Arizona

Country:

United States

Published Applications:

20

Last publication date:

2022-11-24

Top Assignees for applications by James Allen Schlueter

The entities that hold a legal rights for patent applications filed by inventor Schlueter James Allen:

Recent patent applications by Schlueter James Allen

James Allen Schlueter from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-11-24
US20220372332A1
Chemistry; metallurgy

With-In Die Non-Uniformities (WID-NU) In Planarization

#2 | 2020-10-01
US20200308452A1
Chemistry; metallurgy

Low Temperature Mechanical Polishing Or Planarization Slurry For Surfactant Solubility

#3 | 2020-09-03
US20200277514A1
Chemistry; metallurgy

Chemical Mechanical Polishing For Copper And Through Silicon Via Applications

#4 | 2020-04-02
US20200102476A1
Chemistry; metallurgy

Barrier Slurry Removal Rate Improvement

#5 | 2020-03-12
US20200079976A1
Chemistry; metallurgy

Chemical mechanical planarization for tungsten-containing substrates

#6 | 2017-12-21
US20170362466A1
Chemistry; metallurgy

Chemical mechanical polishing (CMP) of cobalt-containing substrate

#7 | 2016-12-08
US20160358790A1
Electricity

Barrier chemical mechanical planarization slurries using ceria-coated silica abrasives

#8 | 2016-10-27
US20160314989A1
Electricity

Low dishing copper chemical mechanical planarization

#9 | 2016-06-23
US20160177134A1
Chemistry; metallurgy

Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof

#10 | 2016-01-28
US20160027657A1
Electricity

Chemical mechanical polishing (CMP) of cobalt-containing substrate

#11 | 2015-09-03
US20150247063A1
Chemistry; metallurgy

Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof

#12 | 2015-05-14
US20150132956A1
Electricity

Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications

#13 | 2015-04-16
US20150104941A1
Chemistry; metallurgy

Barrier chemical mechanical planarization composition and method thereof

#14 | 2015-04-16
US20150104940A1
Chemistry; metallurgy

BARRIER CHEMICAL MECHANICAL PLANARIZATION COMPOSITION AND METHOD THEREOF

#15 | 2015-01-01
US20150004788A1
Electricity

Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications

#16 | 2014-12-25
US20140374378A1
Chemistry; metallurgy

Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof

#17 | 2014-09-18
US20140273458A1
Electricity

Chemical Mechanical Planarization for Tungsten-Containing Substrates

#18 | 2014-04-24
US20140110626A1
Chemistry; metallurgy

Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof

#19 | 2014-04-10
US20140099790A1
Electricity

Chemical mechanical polishing composition having chemical additives and methods for using same

#20 | 2009-03-05
US20090057834A1
Chemistry; metallurgy

Method for chemical mechanical planarization of chalcogenide materials

InventorID:

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