Daeup Bae

City:

Seoul

Country:

South Korea

Published Applications:

Last publication date:

2015-09-08

Top Assignees for applications by Daeup Bae

The entities that hold a legal rights for patent applications filed by inventor Bae Daeup:

Daeup Bae from Seoul, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Integrated circuit packaging system with void prevention mechanism and method of manufacture thereof

InventorID:

7203033 ⎘