Chandler, Arizona
United States
6
2014-09-30
The entities that hold a legal rights for patent applications filed by inventor Barrow Michael:
Michael Barrow from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Exposed die overmolded flip chip package and fabrication method
#2 | 2013-09-24Exposed die overmolded flip chip package and fabrication method
#3 | 2013-07-02Exposed die overmolded flip chip package and fabrication method
#4 | 2013-02-05Exposed die overmolded flip chip package
#5 | 2012-06-26Exposed die overmolded flip chip package method
#6 | 2011-03-01Exposed die overmolded flip chip package and fabrication method
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