Wake Forest, North Carolina
United States
19
2026-05-28
The entities that hold a legal rights for patent applications filed by inventor Namishia Daniel:
Daniel Namishia from Wake Forest, US has applied for patents for these inventions. The list has both pending applications and granted patents:
TRANSISTOR AMPLIFIER WITH PCB ROUTING AND SURFACE MOUNTED TRANSISTOR DIE
#2 | 2025-12-04HIGH-ELECTRON-MOBILITY TRANSISTOR HAVING GROUP-III-NITRIDE CAPPING LAYER SEPARATED FROM CONTACT
#3 | 2024-06-13TRANSISTOR DEVICES INCLUDING SELF-ALIGNED OHMIC CONTACTS AND CONTACT REGIONS AND RELATED FABRICATION METHODS
#4 | 2024-03-28TRANSISTOR AMPLIFIER WITH PCB ROUTING AND SURFACE MOUNTED TRANSISTOR DIE
#5 | 2023-02-02Encapsulation stack for improved humidity performance and related fabrication methods
#6 | 2023-02-02INTERCONNECT METAL OPENINGS THROUGH DIELECTRIC FILMS
#7 | 2022-12-01MULTILAYER ENCAPSULATION FOR HUMIDITY ROBUSTNESS AND RELATED FABRICATION METHODS
#8 | 2022-12-01MULTILAYER ENCAPSULATION FOR HUMIDITY ROBUSTNESS AND HIGHLY ACCELERATED STRESS TESTS AND RELATED FABRICATION METHODS
#9 | 2022-06-30Methods for pillar connection on frontside and passive device integration on backside of die
#10 | 2021-12-02Methods for pillar connection on frontside and passive device integration on backside of die
#11 | 2021-02-11Semiconductor die with improved ruggedness
#12 | 2019-08-22Semiconductor die with improved ruggedness
#13 | 2019-06-06Semiconductor die with improved ruggedness
#14 | 2016-06-16PECVD protective layers for semiconductor devices
#15 | 2015-08-06Stress mitigation for thin and thick films used in semiconductor circuitry
#16 | 2014-09-18Encapsulation of advanced devices using novel PECVD and ALD schemes
#17 | 2014-09-04Floating bond pad for power semiconductor devices
#18 | 2014-05-08Ni-rich Schottky contact
#19 | 2014-04-17Using stress reduction barrier sub-layers in a semiconductor die
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