Benjamin C. Wang

City:

Santa Clara, California

Country:

United States

Published Applications:

Last publication date:

2016-12-22

Top Assignees for applications by Benjamin C. Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Benjamin C.:

Applied Materials, Inc. 3 Santa Clara, CA United States

Recent patent applications by Wang Benjamin C.

Benjamin C. Wang from Santa Clara, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-12-22

US20160372324A1

Electricity

Deposition methods for uniform and conformal hybrid titanium oxide films

#2 | 2014-09-18

US20140273451A1

Electricity

TUNGSTEN DEPOSITION SEQUENCE

#3 | 2014-05-01

US20140120700A1

Electricity

Plasma treatment of film for impurity removal

#4 | 2014-04-17

US20140106083A1

Chemistry; metallurgy

Tungsten growth modulation by controlling surface composition

InventorID:

727404 ⎘