Lien-Chi Chan

City:

Taichung

Country:

Taiwan

Published Applications:

Last publication date:

2008-03-04

Top Assignees for applications by Lien-Chi Chan

The entities that hold a legal rights for patent applications filed by inventor Chan Lien-Chi:

Lien-Chi Chan from Taichung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor package with lead frame as chip carrier and method for fabricating the same

Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same

InventorID:

7279856 ⎘