Taiwan
90
2008-03-11
90
2008-03-11
These are the the leading inventors for applications assigned to Siliconware Precision Industries Co., Ltd.:
Siliconware Precision Industries Co., Ltd. based in , TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Semiconductor package with heat dissipating structure
#2 | 2008-03-04 ✅ Patent 7,339,280 granted on 2008-03-04Semiconductor package with lead frame as chip carrier and method for fabricating the same
#3 | 2008-02-07 ✅ Patent 7,521,285 granted on 2009-04-21Method for fabricating chip-stacked semiconductor package
#4 | 2008-01-17 ✅ Patent 7,489,044 granted on 2009-02-10Semiconductor package and fabrication method thereof
#5 | 2007-11-29 ✅ Patent 7,732,913 granted on 2010-06-08Semiconductor package substrate
#6 | 2007-10-25 ✅ Patent 7,354,796 granted on 2008-04-08Method for fabricating semiconductor package free of substrate
#7 | 2007-10-11 ✅ Patent 7,485,496 granted on 2009-02-03Semiconductor device package with a heat sink and method for fabricating the same
#8 | 2007-09-25 ✅ Patent 7,274,088 granted on 2007-09-25Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof
#9 | 2007-06-14 ✅ Patent 7,535,091 granted on 2009-05-19Multichip stacking structure
#10 | 2007-06-12 ✅ Patent 7,230,323 granted on 2007-06-12Ground-enhanced semiconductor package and lead frame for the same
#11 | 2007-05-17 ✅ Patent 7,364,948 granted on 2008-04-29Method for fabricating semiconductor package
#12 | 2007-05-17 ✅ Patent 7,655,503 granted on 2010-02-02Method for fabricating semiconductor package with stacked chips
#13 | 2007-02-20 ✅ Patent 7,180,183 granted on 2007-02-20Semiconductor device with reinforced under-support structure and method of fabricating the same
#14 | 2007-02-15 ✅ Patent 7,445,957 granted on 2008-11-04Method for fabricating wafer level semiconductor package with build-up layer
#15 | 2007-02-08 ✅ Patent 7,371,617 granted on 2008-05-13Method for fabricating semiconductor package with heat sink
#16 | 2007-01-25 ✅ Patent 7,446,307 granted on 2008-11-04Sensor semiconductor device and fabrication method of the sensor semiconductor device
#17 | 2006-12-12 ✅ Patent 7,148,561 granted on 2006-12-12Ball grid array substrate strip with warpage-preventive linkage structure
#18 | 2006-11-16 ✅ Patent 7,355,279 granted on 2008-04-08Semiconductor device and fabrication method thereof
#19 | 2006-10-12 ✅ Patent 7,489,037 granted on 2009-02-10Semiconductor device and fabrication method thereof
#20 | 2006-10-10 ✅ Patent 7,119,565 granted on 2006-10-10Chip carrier and method for testing electrical performance of passive component
#21 | 2006-09-05 ✅ Patent 7,102,218 granted on 2006-09-05Semiconductor package with chip supporting structure
#22 | 2006-08-03 ✅ Patent 7,315,078 granted on 2008-01-01Chip-stacked semiconductor package and method for fabricating the same
#23 | 2006-06-29 ✅ Patent 7,364,944 granted on 2008-04-29Method for fabricating thermally enhanced semiconductor package
#24 | 2006-06-15 ✅ Patent 7,508,066 granted on 2009-03-24Heat dissipating semiconductor package and fabrication method thereof
#25 | 2006-06-08 ✅ Patent 7,314,820 granted on 2008-01-01Carrier-free semiconductor package and fabrication method thereof
#26 | 2006-06-08 ✅ Patent 7,199,453 granted on 2007-04-03Semiconductor package and fabrication method thereof
#27 | 2006-06-06 ✅ Patent 7,057,276 granted on 2006-06-06Semiconductor package with heat sink
#28 | 2006-05-18 ✅ Patent 7,247,934 granted on 2007-07-24Multi-chip semiconductor package
#29 | 2006-05-16 ✅ Patent 7,045,395 granted on 2006-05-16Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
#30 | 2006-05-04 ✅ Patent 7,164,210 granted on 2007-01-16Semiconductor package with heat sink and method for fabricating same
#31 | 2006-03-28 ✅ Patent 7,019,406 granted on 2006-03-28Thermally enhanced semiconductor package
#32 | 2006-03-09 ✅ Patent 7,271,483 granted on 2007-09-18Bump structure of semiconductor package and method for fabricating the same
#33 | 2006-02-02 ✅ Patent 7,193,309 granted on 2007-03-20Semiconductor package with stacked chips and method for fabricating the same
#34 | 2006-01-26 ✅ Patent 7,170,168 granted on 2007-01-30Flip-chip semiconductor package with lead frame and method for fabricating the same
#35 | 2006-01-26 ✅ Patent 7,196,414 granted on 2007-03-27Semiconductor package with heat sink
#36 | 2006-01-12 ✅ Patent 7,180,161 granted on 2007-02-20Lead frame for improving molding reliability and semiconductor package with the lead frame
#37 | 2005-12-29 ✅ Patent 7,348,211 granted on 2008-03-25Method for fabricating semiconductor packages
#38 | 2005-12-29 ✅ Patent 7,190,067 granted on 2007-03-13Semiconductor package with exposed heat sink and the heat sink thereof
#39 | 2005-12-27 ✅ Patent 6,979,886 granted on 2005-12-27Short-prevented lead frame and method for fabricating semiconductor package with the same
#40 | 2005-12-22 ✅ Patent 7,177,155 granted on 2007-02-13Semiconductor package with heat sink
#41 | 2005-12-06 ✅ Patent 6,972,216 granted on 2005-12-06Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same
#42 | 2005-11-24 ✅ Patent 7,205,674 granted on 2007-04-17Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package
#43 | 2005-11-17 ✅ Patent 7,205,642 granted on 2007-04-17Semiconductor package and method for fabricating the same
#44 | 2005-11-17 ✅ Patent 7,361,846 granted on 2008-04-22High electrical performance semiconductor package
#45 | 2005-11-10 ✅ Patent 7,402,755 granted on 2008-07-22Circuit board with quality-indicator mark and method for indicating quality of the circuit board
#46 | 2005-10-04 ✅ Patent 6,951,776 granted on 2005-10-04Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
#47 | 2005-09-29 ✅ Patent 7,023,085 granted on 2006-04-04Semiconductor package structure with reduced parasite capacitance and method of fabricating the same
#48 | 2005-09-27 ✅ Patent 6,949,414 granted on 2005-09-27Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
#49 | 2005-09-27 ✅ Patent 6,949,413 granted on 2005-09-27Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
#50 | 2005-09-22 ✅ Patent 7,135,642 granted on 2006-11-14Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier
#51 | 2005-09-22 ✅ Patent 7,208,825 granted on 2007-04-24Stacked semiconductor packages
#52 | 2005-09-15 ✅ Patent 7,170,152 granted on 2007-01-30Wafer level semiconductor package with build-up layer and method for fabricating the same
#53 | 2005-09-15 ✅ Patent 7,199,459 granted on 2007-04-03Semiconductor package without bonding wires and fabrication method thereof
#54 | 2005-09-13 ✅ Patent 6,943,439 granted on 2005-09-13Substrate and fabrication method of the same
#55 | 2005-09-08 ✅ Patent 7,271,493 granted on 2007-09-18Semiconductor package free of substrate and fabrication method thereof
#56 | 2005-09-08 ✅ Patent 7,423,340 granted on 2008-09-09Semiconductor package free of substrate and fabrication method thereof
#57 | 2005-09-01 ✅ Patent 7,342,318 granted on 2008-03-11Semiconductor package free of substrate and fabrication method thereof
#58 | 2005-08-23 ✅ Patent 6,933,175 granted on 2005-08-23Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
#59 | 2005-08-11 ✅ Patent 7,126,229 granted on 2006-10-24Wire-bonding method and semiconductor package using the same
#60 | 2005-08-09 ✅ Patent 6,927,485 granted on 2005-08-09Substrate for semiconductor package
#61 | 2005-08-04 ✅ Patent 6,989,296 granted on 2006-01-24Fabrication method of semiconductor package with photosensitive chip
#62 | 2005-07-28 ✅ Patent 7,005,720 granted on 2006-02-28Semiconductor package with photosensitive chip and fabrication method thereof
#63 | 2005-07-19 ✅ Patent 6,919,630 granted on 2005-07-19Semiconductor package with heat spreader
#64 | 2005-07-07 ✅ Patent 7,266,888 granted on 2007-09-11Method for fabricating a warpage-preventive circuit board
#65 | 2005-06-30 ✅ Patent 7,084,474 granted on 2006-08-01Photosensitive semiconductor package and method for fabricating the same
#66 | 2005-06-23 ✅ Patent 7,242,068 granted on 2007-07-10Photosensitive semiconductor package, method for fabricating the same, and lead frame thereof
#67 | 2005-05-12 ✅ Patent 7,019,389 granted on 2006-03-28Lead frame and semiconductor package with the same
#68 | 2005-05-10 ✅ Patent 6,891,273 granted on 2005-05-10Semiconductor package and fabrication method thereof
#69 | 2005-05-05 ✅ Patent 7,074,645 granted on 2006-07-11Fabrication method of semiconductor package with heat sink
#70 | 2005-04-26 ✅ Patent 6,884,652 granted on 2005-04-26Semiconductor package free of substrate and fabrication method thereof
#71 | 2005-04-07 ✅ Patent 7,102,222 granted on 2006-09-05Conductive trace structure and semiconductor package having the conductive trace structure
#72 | 2005-03-22 ✅ Patent 6,870,274 granted on 2005-03-22Flash-preventing window ball grid array semiconductor package, method for fabricating the same, and chip carrier used in the semiconductor package
#73 | 2005-03-17 ✅ Patent 7,203,072 granted on 2007-04-10Heat dissipating structure and semiconductor package with the same
#74 | 2005-03-15 ✅ Patent 6,867,487 granted on 2005-03-15Flash-preventing semiconductor package
#75 | 2005-03-08 ✅ Patent 6,864,434 granted on 2005-03-08Warpage-preventive circuit board and method for fabricating the same
#76 | 2005-03-08 ✅ Patent 6,865,084 granted on 2005-03-08Thermally enhanced semiconductor package with EMI shielding
#77 | 2005-03-08 ✅ Patent 6,864,564 granted on 2005-03-08Flash-preventing semiconductor package
#78 | 2005-03-01 ✅ Patent 6,861,736 granted on 2005-03-01Leadframe-based semiconductor package for multi-media card
#79 | 2005-02-24 ✅ Patent 7,341,949 granted on 2008-03-11Process for forming lead-free bump on electronic component
#80 | 2005-02-24 ✅ Patent 7,102,239 granted on 2006-09-05Chip carrier for semiconductor chip
#81 | 2005-02-24 ✅ Patent 6,856,015 granted on 2005-02-15Semiconductor package with heat sink
#82 | 2005-02-22 ✅ Patent 6,858,931 granted on 2005-02-22Heat sink with collapse structure for semiconductor package
#83 | 2005-02-17 ✅ Patent 6,980,438 granted on 2005-12-27Semiconductor package with heat dissipating structure
#84 | 2005-02-10 ✅ Patent 7,008,826 granted on 2006-03-07Lead-frame-based semiconductor package and fabrication method thereof
#85 | 2005-02-03 ✅ Patent 7,173,828 granted on 2007-02-06Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure
#86 | 2005-02-01 ✅ Patent 6,849,942 granted on 2005-02-01Semiconductor package with heat sink attached to substrate
#87 | 2005-01-25 ✅ Patent 6,847,104 granted on 2005-01-25Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same
#88 | 2005-01-18 ✅ Patent 6,844,622 granted on 2005-01-18Semiconductor package with heat sink
#89 | 2005-01-13 ✅ Patent 7,057,405 granted on 2006-06-06Wafer test method utilizing conductive interposer
#90 | 2005-01-06 ✅ Patent 7,056,818 granted on 2006-06-06Semiconductor device with under bump metallurgy and method for fabricating the same
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