Jun He

Debond interconnect structures

Interconnects having sealing structures to enable selective metal capping layers

Debond interconnect structures

Tamper resistant fuse design

Fuse programming schemes for robust yield

Microelectronic die having CMOS ring oscillator thereon and method of using same

Selective removal of on-die redistribution interconnects from scribe-lines

Apparatus and method for detection of edge damages

Interconnects having sealing structures to enable selective metal capping layers

Fuse programming schemes for robust yield

Systems and methods to passivate on-die redistribution interconnects

Method of reducing interconnect line to line capacitance by using a low k spacer

Standby circuitry for fuse cell

Methods of forming electromigration and thermal gradient based fuse structures

Interconnects having sealing structures to enable selective metal capping layers

Methods of forming electromigration and thermal gradient based fuse structures

Method of forming self-passivating interconnects and resulting devices

Edge arrangements for integrated circuit chips

Mechanically robust dielectric film and stack

Interconnect shunt used for current distribution and reliability redundancy

Mechanically robust interconnect for low-k dielectric material using post treatment

Transistor performance enhancement using engineered strains

Mechanically robust interconnect for low-k dielectric material using post treatment

Interconnect shunt used for current distribution and reliability redundancy

Stress mitigation layer to reduce under bump stress concentration

Interconnect structure for an integrated circuit and method of fabrication

Interconnect structure for an integrated circuit and method of fabrication

Forming defect prevention trenches in dicing streets