Kiel
Germany
18
2021-01-21
The entities that hold a legal rights for patent applications filed by inventor Osterwald Frank:
Frank Osterwald from Kiel, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Sintering tool and method for sintering an electronic subassembly
#2 | 2019-11-07Power module
#3 | 2018-11-15Electronic sandwich structure with two parts joined together by means of a sintering layer
#4 | 2018-10-18METHOD FOR MANUFACTURING A CIRCUIT CARRIER
#5 | 2018-08-23Method for manufacturing semiconductor chips
#6 | 2018-08-02Power semiconductor module
#7 | 2017-12-21Power module
#8 | 2017-11-23POWER SEMICONDUCTOR MODULE WITH SHORT-CIRCUIT FAILURE MODE
#9 | 2017-11-16Cooling trough, cooler and power module assembly
#10 | 2017-11-02Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module
#11 | 2017-11-02Power semiconductor contact structure and method for the production thereof
#12 | 2017-08-10Sintering device
#13 | 2017-08-03Sintering tool for the lower die of a sintering device
#14 | 2017-08-03Sintering tool and method for sintering an electronic subassembly
#15 | 2016-08-04Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#16 | 2014-08-21Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
#17 | 2014-08-14Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#18 | 2013-02-07FLOW DISTRIBUTOR
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