Inventor profile of:

Frank Osterwald

City:

Kiel

Country:

Germany

Published Applications:

18

Last publication date:

2021-01-21

Top Assignees for applications by Frank Osterwald

The entities that hold a legal rights for patent applications filed by inventor Osterwald Frank:

Recent patent applications by Osterwald Frank

Frank Osterwald from Kiel, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-01-21
US20210016353A1
Performing operations; transporting

Sintering tool and method for sintering an electronic subassembly

#2 | 2019-11-07
US20190341341A1
Electricity

Power module

#3 | 2018-11-15
US20180331065A1
Electricity

Electronic sandwich structure with two parts joined together by means of a sintering layer

#4 | 2018-10-18
US20180301354A1
Electricity

METHOD FOR MANUFACTURING A CIRCUIT CARRIER

#5 | 2018-08-23
US20180240776A1
Electricity

Method for manufacturing semiconductor chips

#6 | 2018-08-02
US20180218957A1
Electricity

Power semiconductor module

#7 | 2017-12-21
US20170365541A1
Electricity

Power module

#8 | 2017-11-23
US20170338193A1
Electricity

POWER SEMICONDUCTOR MODULE WITH SHORT-CIRCUIT FAILURE MODE

#9 | 2017-11-16
US20170332515A1
Electricity

Cooling trough, cooler and power module assembly

#10 | 2017-11-02
US20170317051A1
Electricity

Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module

#11 | 2017-11-02
US20170317049A1
Electricity

Power semiconductor contact structure and method for the production thereof

#12 | 2017-08-10
US20170229418A1
Electricity

Sintering device

#13 | 2017-08-03
US20170221852A1
Electricity

Sintering tool for the lower die of a sintering device

#14 | 2017-08-03
US20170216920A1
Performing operations; transporting

Sintering tool and method for sintering an electronic subassembly

#15 | 2016-08-04
US20160225738A1
Electricity

Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof

#16 | 2014-08-21
US20140230989A1
Electricity

Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips

#17 | 2014-08-14
US20140225247A1
Electricity

Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof

#18 | 2013-02-07
US20130032230A1
Electricity

FLOW DISTRIBUTOR

InventorID:

73493 ⎘