Toshiya KAMADA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2015-12-10

Top Assignees for applications by Toshiya KAMADA

The entities that hold a legal rights for patent applications filed by inventor KAMADA Toshiya:

Toshiya KAMADA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

High strength Cu—Ni—Co—Si based copper alloy sheet material and method for producing the same, and current carrying component

Cu—Ti based copper alloy sheet material and method for producing the same, and electric current carrying component

Cu-Ni-Co-Si based copper alloy sheet material and method for producing the same

InventorID:

741046 ⎘