Robert Edgeworth

City:

Phoenix, Arizona

Country:

United States

Published Applications:

Last publication date:

2016-06-09

Top Assignees for applications by Robert Edgeworth

The entities that hold a legal rights for patent applications filed by inventor Edgeworth Robert:

Robert Edgeworth from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (TSVs)

PROCESS AND MATERIAL FOR PREVENTING DELETERIOUS EXPANSION OF HIGH ASPECT RATIO COPPER FILLED THROUGH SILICON VIAS (TSVS)

Dielectric with fluorescent material

InventorID:

742244 ⎘