Fremont, California
United States
34
2025-07-10
The entities that hold a legal rights for patent applications filed by inventor EGAN Todd J.:
Todd J. EGAN from Fremont, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SYSTEM AND METHOD TO MAP THICKNESS VARIATIONS OF SUBSTRATES IN MANUFACTURING SYSTEMS
#2 | 2024-12-05MULTI-TARGET DESIGN FOR IN-SITU ANALYSIS OF SEMICONDUCTOR FABRICATION PROCESS
#3 | 2024-09-12REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER MANUFACTURING
#4 | 2024-04-18In-line monitoring of OLED layer thickness and dopant concentration
#5 | 2024-04-04Surface roughness and emissivity determination
#6 | 2023-09-28Autonomous substrate processing system
#7 | 2023-07-06METHODS AND SYSTEMS TO MEASURE PROPERTIES OF MOVING PRODUCTS IN DEVICE MANUFACTURING MACHINES
#8 | 2023-06-01MONITORING OF DEPOSITED OR ETCHED FILM THICKNESS USING IMAGE-BASED MASS DISTRIBUTION METROLOGY
#9 | 2023-01-12System and method to map thickness variations of substrates in manufacturing systems
#10 | 2022-11-17Image-based in-situ process monitoring
#11 | 2022-09-15Optical metrology models for in-line film thickness measurements
#12 | 2022-07-07Autonomous substrate processing system
#13 | 2022-02-24Methods and systems to measure properties of products on a moving blade in electronic device manufacturing machines
#14 | 2021-07-22In-line monitoring of OLED layer thickness and dopant concentration
#15 | 2021-07-22Spectrum shaping devices and techniques for optical characterization applications
#16 | 2021-01-07Real-time detection of particulate matter during deposition chamber manufacturing
#17 | 2020-11-12Imaging reflectometer
#18 | 2020-07-23Imaging reflectometer
#19 | 2019-12-26METHODS, APPARATUSES AND SYSTEMS FOR CONDUCTIVE FILM LAYER THICKNESS MEASUREMENTS
#20 | 2019-02-14Temperature control for additive manufacturing
#21 | 2017-08-10Non-Contact Sheet Resistance Measurement of Barrier and/or Seed Layers Prior to Electroplating
#22 | 2016-08-02Apparatus and method for optical calibration of wafer placement by a robot
#23 | 2016-01-07Apparatus, systems, and methods for temperature control of substrates using embedded fiber optics and epoxy optical diffusers
#24 | 2014-12-18Electroplating tool with feedback of metal thickness distribution and correction
#25 | 2014-12-18Fast and continuous eddy-current metrology of a conductive film
#26 | 2014-12-18Non-contact sheet resistance measurement of barrier and/or seed layers prior to electroplating
#27 | 2014-09-18Acoustically-monitored semiconductor substrate processing systems and methods
#28 | 2014-05-29Hybrid laser and plasma etch wafer dicing using substrate carrier
#29 | 2014-05-01Film measurement
#30 | 2012-12-20Hybrid laser and plasma etch wafer dicing using substrate carrier
#31 | 2010-04-29Spectrographic metrology of patterned wafers
#32 | 2009-05-21THREE DIMENSIONAL PACKAGING WITH WAFER-LEVEL BONDING AND CHIP-LEVEL REPAIR
#33 | 2009-05-21Die-to-robot alignment for die-to-substrate bonding
#34 | 2009-01-22Dual-mode robot systems and methods for electronic device manufacturing
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