Hsinchu
Taiwan
36
2026-04-23
The entities that hold a legal rights for patent applications filed by inventor Chen Wei-Ming:
Wei-Ming Chen from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD AND NON-TRANSITORY COMPUTER-READABLE MEDIUM FOR ARRANGING COMPONENTS WITHIN A SEMICONDUCTOR DEVICE
#2 | 2025-11-27METHOD AND SYSTEM FOR THERMAL-AWARE ELECTROMIGRATION EVALUATION AND CIRCUIT DESIGN
#3 | 2025-10-16METHOD FOR ESTIMATING TEMPERATURE INFORMATION OF INTEGRATED CIRCUIT DESIGN
#4 | 2025-08-07METHODS AND NON-TRANSITORY COMPUTER-READABLE MEDIA FOR INTER-METAL DIELECTRIC RELIABILITY CHECK
#5 | 2024-11-21METHOD AND APPARATUS FOR ELECTROMIGRATION EVALUATION
#6 | 2024-11-07ELECTRICALLY AWARE ROUTING FOR INTEGRATED CIRCUITS
#7 | 2024-02-08METHOD AND NON-TRANSITORY COMPUTER-READABLE MEDIUM FOR ARRANGING COMPONENTS WITHIN A SEMICONDUCTOR DEVICE
#8 | 2023-08-17Methods and non-transitory computer-readable media for inter-metal dielectric reliability check
#9 | 2023-08-10Method and apparatus for electromigration evaluation
#10 | 2022-10-20Electrically aware routing for integrated circuits
#11 | 2022-08-04Stacked Integrated Circuit Structure and Method of Forming
#12 | 2022-07-07Method and apparatus for electromigration evaluation
#13 | 2022-04-14Electromigration evaluation methodology with consideration of current distribution
#14 | 2021-08-05Stacked Integrated Circuit Structure and Method of Forming
#15 | 2020-07-02Wireless charging device
#16 | 2017-01-12Artificial retinal prosthesis system, optical device and retina chip
#17 | 2015-01-08SOLAR CELL
#18 | 2014-09-25Electronic device package
#19 | 2014-03-13Semiconductor hole structure
#20 | 2013-08-01Power MOSFET package
#21 | 2013-03-14Electronic device package
#22 | 2013-02-21Method for fabricating electronic device package
#23 | 2013-02-07Chip package structure using flexible substrate
#24 | 2012-08-02SOLAR CELL AND ITS ELECTRODE STRUCTURE
#25 | 2012-02-16SEMICONDUCTOR SUBSTRATE
#26 | 2011-08-11Electronic device package and fabrication method thereof
#27 | 2011-06-16Electronic device package and method for fabricating the same
#28 | 2011-04-14Chip package and fabrication method thereof
#29 | 2011-02-24Chip package and method for forming the same
#30 | 2010-11-18Power MOSFET package
#31 | 2010-07-29Electronic device package and method for fabricating the same
#32 | 2009-11-26Electronic device package and fabrication method thereof
#33 | 2008-02-21Method for manufacturing, writing method and reading non-volatile memory
#34 | 2007-06-28Butted contact structure
#35 | 2006-06-08Magnetic memory array
#36 | 2006-06-08Magnetic memory array
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