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Inventor profile of:

Hung-Che Shen

City:

Hsinchu

Country:

Taiwan

Published Applications:

2

Last publication date:

2013-02-07

Top Assignees for applications by Hung-Che Shen

The entities that hold a legal rights for patent applications filed by inventor Shen Hung-Che:

CHIPMOS TECHNOLOGIES INC. 1 Hsinchu, Taiwan

Recent patent applications by Shen Hung-Che

Hung-Che Shen from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-02-07

US20130032940A1

CHIP PACKAGE STRUCTURE

#2 | 2009-10-29

US20090267229A1

CHIP PACKAGE STRUCTURE

InventorID:

74922 ⎘