Markham
Canada
17
2023-05-18
The entities that hold a legal rights for patent applications filed by inventor Topacio Roden:
Roden Topacio from Markham, CA has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor package assembly using a passive device as a standoff
#2 | 2016-05-05Circuit board with constrained solder interconnect pads
#3 | 2014-06-19Routing layer for mitigating stress in a semiconductor die
#4 | 2014-04-24Routing layer for mitigating stress in a semiconductor die
#5 | 2013-12-26Thermal management circuit board for stacked semiconductor chip device
#6 | 2013-06-20Semiconductor chip with underfill anchors
#7 | 2013-03-21Die substrate with reinforcement structure
#8 | 2013-02-07Routing layer for mitigating stress in a semiconductor die
#9 | 2012-10-25Routing layer for mitigating stress in a semiconductor die
#10 | 2011-10-20Routing layer for mitigating stress in a semiconductor die
#11 | 2011-09-22Method of manufacturing substrates having asymmetric buildup layers
#12 | 2011-05-05Circuit Board with Variable Topography Solder Interconnects
#13 | 2011-04-28Routing layer for mitigating stress in a semiconductor die
#14 | 2011-02-03METHOD OF MANUFACTURING SUBSTRATES HAVING ASYMMETRIC BUILDUP LAYERS
#15 | 2009-09-24Die substrate with reinforcement structure
#16 | 2008-05-01Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip
#17 | 2008-03-06Method and apparatus for making semiconductor packages
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