Kyonggi-do
South Korea
7
2014-01-02
The entities that hold a legal rights for patent applications filed by inventor Moon DongSoo:
DongSoo Moon from Kyonggi-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die
#2 | 2013-10-10Semiconductor device with bump formed on substrate to prevent ELK ILD delamination during reflow process
#3 | 2013-04-11Semiconductor device including bump formed on substrate to prevent extremely-low dielectric constant (ELK) interlayer dielectric layer (ILD) delamination during reflow process
#4 | 2013-02-07Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die
#5 | 2012-08-23Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die
#6 | 2012-03-15Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die
#7 | 2011-10-27Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process
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