Joe Walczyk

3D DIE STACK REDISTRIBUTION LAYER FOR TOPSIDE POWER DELIVERY TO BACKSIDE DIE METALLIZATION IN MULTICHIP COMPOSITE DEVICES

HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES

Dual-sided socket device with corrugation structures and shield structures

Additively manufactured structures for heat dissipation from integrated circuit devices

Integrated circuit die packages including a contiguous heat spreader

Hybrid thermal interface material (TIM) with reduced 3D thermal resistance

Hybrid backside thermal structures for enhanced IC packages

Slip-plane MEMs probe for high-density and fine pitch interconnects

High density and fine pitch interconnect structures in an electric test apparatus

DEFLECTED-PILLAR COMPOSITE COMPLIANT ELONGATED MICRO-STRUCTURE THERMAL INTERFACE MATERIALS

Micro-coaxial wire interconnect architecture

Slip-plane MEMS probe for high-density and fine pitch interconnects

High density and fine pitch interconnect structures in an electric test apparatus

High density and fine pitch interconnect structures in an electric test apparatus

Electrical testing apparatus with lateral movement of a probe support substrate

Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays

Conformable heat spreader

Low profile edge clamp socket

Shielded interconnect array

ACTUATION MECHANISMS FOR ELECTRICAL INTERCONNECTIONS

Actuation mechanisms for electrical interconnections

Seal method for direct liquid cooling of probes used at first level interconnect