Son Van Nguyen

City:

Gilbert, Arizona

Country:

United States

Published Applications:

Last publication date:

2026-04-30

Top Assignees for applications by Son Van Nguyen

The entities that hold a legal rights for patent applications filed by inventor Nguyen Son Van:

Son Van Nguyen from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:

BOTTOM-UP ELECTROPLATED VIAS FOR PACKAGE SUBSTRATES AND RELATED METHODS

FRAMES FOR GLASS CORE HYBRID PANELS

HYBRID GLASS AND ORGANIC SUBSTRATES

InventorID:

7670604 ⎘