Deepak V. Kulkarni

City:

Chandler, Arizona

Country:

United States

Published Applications:

Last publication date:

2017-05-04

Top Assignees for applications by Deepak V. Kulkarni

The entities that hold a legal rights for patent applications filed by inventor Kulkarni Deepak V.:

INTEL CORPORATION 5 Santa Clara, CA United States

Recent patent applications by Kulkarni Deepak V.

Deepak V. Kulkarni from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-05-04

US20170125351A1

Electricity

Logic die and other components embedded in build-up layers

#2 | 2016-06-02

US20160151850A1

Performing operations; transporting

Methods of fabricating low melting point solder reinforced sealant and structures formed thereby

#3 | 2014-08-07

US20140217599A1

Electricity

BBUL material integration in-plane with embedded die for warpage control

#4 | 2014-05-22

US20140138845A1

Electricity

Logic die and other components embedded in build-up layers

#5 | 2011-06-30

US20110159310A1

Performing operations; transporting

Methods of fabricating low melting point solder reinforced sealant and structures formed thereby

InventorID:

767932 ⎘