Haiming
Germany
7
2022-03-17
The entities that hold a legal rights for patent applications filed by inventor Heilmaier Alexander:
Alexander Heilmaier from Haiming, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD FOR POLISHING A SEMICONDUCTIOR WAFER
#2 | 2014-10-16Method for polishing semiconductor wafers by means of simultaneous double-side polishing
#3 | 2014-07-24Method for polishing a semiconductor wafer
#4 | 2014-05-22PROCESS FOR POLISHING A SEMICONDUCTOR WAFER, COMPRISING THE SIMULTANEOUS POLISHING OF A FRONT SIDE AND OF A REVERSE SIDE OF A SUBSTRATE WAFER
#5 | 2010-03-04Method for producing a semiconductor wafer
#6 | 2008-05-01Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers
#7 | 2006-09-21Method for removing material from a semiconductor wafer
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