Reut
Germany
14
2023-09-14
The entities that hold a legal rights for patent applications filed by inventor Wiesner Peter:
Peter Wiesner from Reut, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes
#2 | 2023-07-27METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEANS OF A WIRE SAW DURING A SEQUENCE OF SEPARATION PROCESSES
#3 | 2023-07-27Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes
#4 | 2023-07-20METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEANS OF A WIRE SAW DURING A SEQUENCE OF SEPARATION PROCESSES
#5 | 2023-02-16METHOD FOR SEPARATING MULTIPLE SLICES OF WORKPIECES BY MEANS OF A WIRE SAW DURING A SEQUENCE OF SEPARATION PROCESSES
#6 | 2022-07-28METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES DURING A NUMBER OF SEPARATING PROCESSES BY MEANS OF A WIRE SAW, AND SEMICONDUCTOR WAFER MADE OF MONOCRYSTALLINE SILICON
#7 | 2022-02-10METHOD FOR PRODUCING SEMICONDUCTOR WAFERS BY MEANS OF A WIRE SAW
#8 | 2015-06-11Method for slicing wafers from a workpiece by means of a wire saw
#9 | 2014-05-29Method for resuming a wire sawing process of a workpiece after an unplanned interruption
#10 | 2012-09-27Method for slicing wafers from a workpiece
#11 | 2012-09-27Method for slicing wafers from a workpiece
#12 | 2012-07-12Method for cooling a workpiece made of semiconductor material during wire sawing
#13 | 2008-10-30Wire guide roll for wire saw and method
#14 | 2008-01-17Sawing strip and method for simultaneously cutting off a multiplicity of slices from a cylindrical workpiece using a sawing strip
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