Jongmin Shin

City:

Schenectady, New York

Country:

United States

Published Applications:

Last publication date:

2026-06-04

Top Assignees for applications by Jongmin Shin

The entities that hold a legal rights for patent applications filed by inventor Shin Jongmin:

Jongmin Shin from Schenectady, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Stacked Semiconductor Device Including Thick Bottom Isolation Layer Below Gate Structure

INTEGRATED CIRCUIT DEVICES INCLUDING HIGH-DENSITY CAPACITORS

InventorID:

7780975 ⎘