JAMES IBBETSON

Lighting fixture and methods

Multi-layer conversion material for down conversion in solid state lighting

Light fixtures and methods

Skylight fixture emulating natural exterior light

Circadian light fixtures, and other devices

Skylight Fixture

Solid state lighting device providing spectral power distribution with enhanced perceived brightness

MOLDED CHIP FABRICATION METHOD AND APPARATUS

Skylight fixture

Skylight fixture

Light fixtures and methods

Optical waveguide and lamp including same

Luminaire with controllable light emission

Wire bond free wafer level LED

High powered light emitter packages with compact optics

Stabilized quantum dot structure and method of making a stabilized quantum dot structure

Optical waveguide and luminaire incorporating same

Low profile lighting module

High efficiency LED lamp

Solid state lighting apparatus with high scotopic/photopic (S/P) ratio

FLIP-CHIP PHOSPHOR COATING METHOD AND DEVICES FABRICATED UTILIZING METHOD

Multi-layer conversion material for down conversion in solid state lighting

Chip with integrated phosphor

Optical waveguide and luminaire incorporating same

Optical waveguide and luminaire incorporating same

Optical waveguide and lamp including same

COMPOSITE HIGH REFLECTIVITY LAYER

Molded chip fabrication method and apparatus

Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface

ROUGHENED HIGH REFRACTIVE INDEX LAYER/LED FOR HIGH LIGHT EXTRACTION

Lateral semiconductor light emitting diodes having large area contacts

Composite high reflectivity layer

Solid state lighting component

Light emitting diode dielectric mirror

Quantum dot narrow-band downconverters for high efficiency LEDs

Low profile lighting module with side emitting LEDs

Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface

Light emitting devices with low packaging factor

White LEDs with emission wavelength correction

Solid state lighting device including green shifted red component

COMPACT HIGH EFFICIENCY REMOTE LED MODULE

Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures

Composite high reflectivity layer

Solid state lighting component

High reflective board or substrate for LEDs

Horizontal light emitting diodes including phosphor particles

Ultra-thin ohmic contacts for p-type nitride light emitting devices

Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface

Monolithic Multi-Junction Light Emitting Devices Including Multiple Groups of Light Emitting Diodes

High voltage low current surface emitting light emitting diode

High voltage low current surface emitting LED

White-emitting LED chips and method for making same

Enhanced color rendering index emitter through phosphor separation

Group III nitride based light emitting diode structures with multiple quantum well structures having varying well thicknesses

Molded chip fabrication method and apparatus

Composite high reflectivity layer

Lateral semiconductor Light Emitting Diodes having large area contacts

Semiconductor light emitting devices with applied wavelength conversion materials and methods for forming the same

High reflectivity mirrors and method for making same

Solid state lighting component

Molded chip fabrication method and apparatus

LED with substrate modifications for enhanced light extraction and method of making same

High voltage low current surface emitting LED

Light emitting diode chip with electrical insulation element

High voltage low current surface-emitting LED

Light emitting diode with a dielectric mirror having a lateral configuration

Composite high reflectivity layer

Semiconductor light emitting diodes having reflective structures and methods of fabricating same

Molded chip fabrication method and apparatus

LED with substrate modifications for enhanced light extraction and method of making same

Flip-chip phosphor coating method and devices fabricated utilizing method

Wire bond free wafer level LED

Multiple conversion material light emitting diode package and method of fabricating same

Solid state lighting component

Solid state lighting component

Semiconductor light emitting devices with applied wavelength conversion materials

Coating method utilizing phosphor containment structure and devices fabricated using same

Microscale optoelectronic device packages

Double flip semiconductor device and method for fabrication

Wafer level phosphor coating method and devices fabricated utilizing method

Wafer level phosphor coating method and devices fabricated utilizing method

Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices

Methods of fabricating group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures

Light emitting diode package with optical element

High power solid-state lamp

Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management

Roughened high refractive index layer/LED for high light extraction

Power lamp package

High efficacy white LED

Ultra-thin ohmic contacts for p-type nitride light emitting devices

Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices

LED with substrate modifications for enhanced light extraction and method of making same

Light emitting diode with porous SiC substrate and method for fabricating

Composite white light source and method for fabricating

Molded chip fabrication method

Group III nitride based superlattice structures