Unterhaching
Germany
28
2025-09-11
The entities that hold a legal rights for patent applications filed by inventor Dinkel Markus:
Markus Dinkel from Unterhaching, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE WITH HYBRID INTERCONNECT CLIP
#2 | 2025-07-03PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITIONAL CARRIER HAVING REFERENCE POTENTIAL STRUCTURE
#3 | 2023-11-30Method of manufacturing a package using a clip having at least one locking recess
#4 | 2023-07-20SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR CHIP, AND METHOD OF FORMING A CHIP SYSTEM
#5 | 2023-06-15Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element
#6 | 2023-03-30Semiconductor Packages and Methods for Manufacturing Thereof
#7 | 2022-07-21Method of fabricating a semiconductor package
#8 | 2021-02-04SEMICONDUCTOR PACKAGE INCLUDING A CAVITY IN ITS PACKAGE BODY
#9 | 2021-01-21Leadframe leads having fully plated end faces
#10 | 2020-11-19Clip having locking recess for connecting an electronic component with a carrier in a package
#11 | 2020-10-15Plurality of transistor packages with exposed source and drain contacts mounted on a carrier
#12 | 2020-05-07Method of producing an SMD package with top side cooling
#13 | 2020-04-30Semiconductor package and method of fabricating a semiconductor package
#14 | 2019-03-14SMD package with top side cooling
#15 | 2018-10-18SMD package with flat contacts to prevent bottleneck
#16 | 2017-10-05Semiconductor package having a source-down configured transistor die and a drain-down configured transistor die
#17 | 2017-09-21Leadframe leads having fully plated end faces
#18 | 2016-12-29Semiconductor package with integrated magnetic field sensor
#19 | 2016-12-29Power package with integrated magnetic field sensor
#20 | 2016-12-29Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto
#21 | 2016-12-01Semiconductor device including lead frames with downset
#22 | 2016-11-10Electronic device including a metal substrate and a semiconductor module embedded in a laminate
#23 | 2016-04-21Electronic module having an electrically insulating structure with material having a low modulus of elasticity
#24 | 2016-02-18Module with integrated power electronic circuitry and logic circuitry
#25 | 2016-01-14Semiconductor device and method for manufacturing a semiconductor device
#26 | 2015-03-05Overmolded substrate-chip arrangement with heat sink
#27 | 2014-06-19Semiconductor device and method for manufacturing a semiconductor device
#28 | 2014-06-19SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
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