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Inventor profile of:

Wei Sun

City:

Shanghai

Country:

China

Published Applications:

Last publication date:

2025-10-02

Top Assignees for applications by Wei Sun

The entities that hold a legal rights for patent applications filed by inventor Sun Wei:

STATS CHIPPAC, LTD. 2 Singapore, Singapore
INTERNATIONAL BUSINESS MACHINES CORPORATION 2 ARMONK, NY United States
Honeywell International Inc. 1 Charlotte, NC United States
SAP SE 1 Walldorf, Germany
ETHICON ENDO-SURGERY, INC. 1 Cincinnati, OH United States
HONEYWELL INTERNATIONAL INC. 1 Morris Plains, NJ United States
Schneider Electric Industries SAS 1 Rueil Malmaison, France
STATS ChipPAC Pte Ltd. 1 Singapore, Singapore

Recent patent applications by Sun Wei

Wei Sun from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-10-02

US20250303024A1

Human necessities

INDIVIDUALIZED NERVE CONDUIT WITH DIFFERENTIATED INTERFACES

#2 | 2025-06-05

US20250181335A1

Physics

TRANSLATION QUALITY ASSURANCE BASED ON LARGE LANGUAGE MODELS

#3 | 2024-10-03

US20240331081A1

Physics

IMAGE PROCESSING METHOD, CHIP, ELECTRONIC DEVICE, AND STORAGE MEDIUM

#4 | 2024-09-26

US20240315879A1

Human necessities

APPARATUSES, SYSTEMS, AND METHODS FOR INCREASING OR MANIPULATING NOISE ATTENUATION IN HEARING PROTECTION DEVICE

#5 | 2024-04-30

US18097444

Physics

Multi-resource operations in an analytics computing system

#6 | 2024-03-28

US20240106251A1

Electricity

CHARGING DEVICE AND METHOD FOR PREVENTING DEW CONDENSATION OF CHARGING DEVICE

#7 | 2022-03-03

US20220062056A1

Human necessities

Apparatuses, systems, and methods for increasing or manipulating noise attenuation in hearing protection device

#8 | 2020-12-24

US20200400616A1

Physics

Method, apparatus and system for detecting internal defect in protective headgear

#9 | 2017-08-24

US20170238927A1

Human necessities

Linear stapler with a multi-functional retaining pin subassembly

#10 | 2014-09-18

US20140264850A1

Electricity

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

#11 | 2014-06-26

US20140175151A1

Human necessities

Linear Staple with a Multi-Functional Retaining Pin Subassembly

#12 | 2011-09-29

US20110233766A1

Electricity

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

#13 | 2011-07-21

US20110178981A1

Physics

COLLECTING COMMUNITY FEEDBACK FOR COLLABORATIVE DOCUMENT DEVELOPMENT

InventorID:

811282 ⎘