Seoul
South Korea
4
2016-06-09
The entities that hold a legal rights for patent applications filed by inventor Yee JaeHak:
JaeHak Yee from Seoul, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form
#2 | 2014-06-26Semiconductor device and method of making bumpless flipchip interconnect structures
#3 | 2014-06-26Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form
#4 | 2014-06-26Semiconductor device and method of simultaneous molding and thermalcompression bonding
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