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Inventor profile of:

Jong Won LEE

City:

Suwon-si

Country:

South Korea

Published Applications:

Last publication date:

2025-12-04

Top Assignees for applications by Jong Won LEE

The entities that hold a legal rights for patent applications filed by inventor LEE Jong Won:

Samsung SDI Co., Ltd. 6 Yongin-si, South Korea
SAMSUNG ELECTRONICS CO., LTD. 6 Suwon-si, South Korea
Samsung Electronics Co., Ltd 2 , South Korea
SAMSUNG ELECTRONICS CO., LTD. 2 Gyeonggi-Do, South Korea
Kia Motors Corporation 1 Seoul, South Korea
Hyundai Motor Company 1 Seoul, South Korea
SAMSUNG ELECTIONICS CO., LTD. 1 Suwon-si, South Korea

Recent patent applications by LEE Jong Won

Jong Won LEE from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-12-04

US20250372409A1

Electricity

SUBSTRATE TREATING APPARATUS AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME

#2 | 2025-11-13

US20250349632A1

Electricity

SEMICONDUCTOR PACKAGE

#3 | 2025-07-10

US20250224902A1

Physics

COMPUTATIONAL STORAGE DEVICE, METHOD FOR OPERATING THE COMPUTATIONAL STORAGE DEVICE AND METHOD FOR OPERATING HOST DEVICE

#4 | 2024-07-11

US20240231687A9

Physics

COMPUTATIONAL STORAGE DEVICE, METHOD FOR OPERATING THE COMPUTATIONAL STORAGE DEVICE AND METHOD FOR OPERATING HOST DEVICE

#5 | 2024-07-04

US20240220151A1

Physics

COMPUTATIONAL STORAGE DEVICE AND METHOD FOR OPERATING THE DEVICE

#6 | 2024-06-13

US20240193105A1

Physics

Computational storage device and method of operating the same

#7 | 2024-04-25

US20240134568A1

Physics

Computational storage device, method for operating the computational storage device and method for operating host device

#8 | 2023-04-06

US20230108531A1

Chemistry; metallurgy

CMP SLURRY COMPOSITION FOR PATTERNED TUNGSTEN WAFER AND METHOD OF POLISHING PATTERNED TUNGSTEN WAFER USING THE SAME

#9 | 2022-09-22

US20220298382A1

Chemistry; metallurgy

CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same

#10 | 2022-09-22

US20220298381A1

Chemistry; metallurgy

CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN PATTERN WAFER AND METHOD OF POLISHING TUNGSTEN PATTERN WAFER USING THE SAME

#11 | 2022-04-14

US20220112401A1

Chemistry; metallurgy

CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN PATTERN WAFER AND METHOD OF POLISHING TUNGSTEN PATTERN WAFER USING THE SAME

#12 | 2022-01-27

US20220025214A1

Chemistry; metallurgy

CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same

#13 | 2021-07-29

US20210230451A1

Chemistry; metallurgy

CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same

#14 | 2021-04-22

US20210115296A1

Chemistry; metallurgy

CMP slurry composition for copper films and method of polishing copper films using the same

#15 | 2021-01-14

US20210011599A1

Physics

Method and system for controlling device

#16 | 2016-06-02

US20160154519A1

Physics

Method and system for controlling device

#17 | 2016-05-05

US20160124617A1

Physics

Method of displaying object on device, device for performing the same, and recording medium for performing the method

#18 | 2015-11-26

US20150335514A1

Human necessities

Driving modules and motion assistance apparatuses including the same

#19 | 2015-07-30

US20150215901A1

Electricity

Apparatus and method for providing communication

#20 | 2014-07-03

US20140182530A1

Mechanical engineering

Inspection system for continuous variable valve lift device

InventorID:

819352 ⎘