Suwon-si
South Korea
38
2025-03-20
The entities that hold a legal rights for patent applications filed by inventor Lee Jin Won:
Jin Won Lee from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
PRINTED CIRCUIT BOARD
#2 | 2024-07-11OPTICAL DISC UNIT FOR ULTRAVIOLET STERILIZER, METHOD OF MANUFACTURING THE SAME, AND ULTRAVIOLET STERILIZER INCLUDING THE SAME
#3 | 2024-03-14Printed circuit board
#4 | 2024-02-15PRINTED CIRCUIT BOARD
#5 | 2023-11-16Antenna module
#6 | 2023-11-09LED lamp for a vehicle and a method of manufacturing the same using mid and magnetic induction technologies
#7 | 2023-11-02PRINTED CIRCUIT BOARD AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT EMBEDDED THEREIN
#8 | 2023-07-06SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#9 | 2022-10-27Printed circuit board
#10 | 2022-06-30Coil component
#11 | 2022-06-16Connection structure embedded substrate
#12 | 2022-06-02Coil component
#13 | 2022-05-26Flexible printed circuit board and electronic device including the same
#14 | 2022-05-26Coil component
#15 | 2022-05-19Printed circuit board
#16 | 2022-04-28Substrate having electronic component embedded therein
#17 | 2022-03-24Printed circuit board
#18 | 2022-03-10Printed circuit board and substrate including electronic component embedded therein
#19 | 2022-02-24Method of manufacturing a semiconductor device
#20 | 2022-01-18Printed circuit board
#21 | 2022-01-13Antenna module
#22 | 2022-01-13Antenna module
#23 | 2022-01-13Radio frequency package
#24 | 2021-12-30Printed circuit board
#25 | 2021-12-21Connection substrate and interposer substrate including the same
#26 | 2021-09-16Substrate structure and electronic device including the same
#27 | 2021-06-24Substrate having electronic component embedded therein
#28 | 2021-06-24Substrate having electronic component embedded therein
#29 | 2021-06-17Electronic component embedded substrate
#30 | 2021-06-17Substrate embedded electronic component package
#31 | 2020-12-24Printed circuit board
#32 | 2020-12-08Printed circuit board
#33 | 2020-10-15Semiconductor devices
#34 | 2020-05-28Printed circuit board and manufacturing method for the same
#35 | 2020-04-16Semiconductor package
#36 | 2020-03-12Substrate having embedded interconnect structure
#37 | 2014-07-03Surface modified silica by alkyl sulfonated tetrazole compound, preparing method thereof, and resin composition containing the same
#38 | 2014-07-03RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD
823778 ⎘