Inventor profile of:

John C. Forster

City:

Mountain View, California

Country:

United States

Published Applications:

17

Last publication date:

2026-01-08

Top Assignees for applications by John C. Forster

The entities that hold a legal rights for patent applications filed by inventor Forster John C.:

Recent patent applications by Forster John C.

John C. Forster from Mountain View, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-01-08
US20260011900A1
Electricity

WIDEBAND TEM TO TM01 MODE CONVERTER FOR MICROWAVE PLASMA SYSTEMS

#2 | 2025-09-25
US20250299926A1
Electricity

BIASABLE GAS DISTRIBUTION PLATE

#3 | 2024-06-06
US20240186128A1
Electricity

METHODS AND APPARATUS FOR REDUCING SPUTTERING OF A GROUNDED SHIELD IN A PROCESS CHAMBER

#4 | 2023-05-25
US20230162954A1
Electricity

High temperature detachable very high frequency (VHF) electrostatic chuck (ESC) for PVD chamber

#5 | 2023-04-20
US20230122956A1
Chemistry; metallurgy

Methods and apparatus for processing a substrate

#6 | 2021-11-04
US20210343508A1
Electricity

Metal oxide preclean chamber with improved selectivity and flow conductance

#7 | 2020-10-01
US20200312640A1
Electricity

Methods and apparatus for reducing sputtering of a grounded shield in a process chamber

#8 | 2020-01-16
US20200020509A1
Electricity

Apparatus for depositing metal films with plasma treatment

#9 | 2018-05-10
US20180130642A1
Electricity

Methods and systems to modulate film stress

#10 | 2018-01-11
US20180012732A1
Electricity

Apparatus for depositing metal films with plasma treatment

#11 | 2016-06-16
US20160172227A1
Electricity

Electrostatic chuck design for high temperature RF applications

#12 | 2016-03-24
US20160086775A1
Electricity

Apparatus and method for depositing electronically conductive pasting material

#13 | 2015-02-19
US20150048739A1
Electricity

Elongated capacitively coupled plasma source for high temperature low pressure environments

#14 | 2014-09-18
US20140262764A1
Chemistry; metallurgy

Methods and apparatus for reducing sputtering of a grounded shield in a process chamber

#15 | 2014-09-18
US20140262043A1
Electricity

Substrate support for plasma etch operations

#16 | 2014-07-17
US20140196746A1
Electricity

In situ chamber clean with inert hydrogen helium mixture during wafer process

#17 | 2012-09-06
US20120225558A1
Electricity

Methods for contact clean

InventorID:

835955 ⎘