Riesa
Germany
17
2025-06-26
The entities that hold a legal rights for patent applications filed by inventor Proschwitz Jan:
Jan Proschwitz from Riesa, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Active Cooling for Heterogenous Packages
#2 | 2025-06-19SELF-ALIGNING SEMICONDUCTOR CONSTRUCTION
#3 | 2025-04-03DIE PLACEMENT WITHIN A FORMED CAVITY ON A REDISTRIBUTION LAYER
#4 | 2023-10-05THREE-DIMENSIONAL STACK COOLING WINGS
#5 | 2023-10-05DUAL-SIDED TERMINAL DEVICE WITH SPLIT SIGNAL AND POWER ROUTING
#6 | 2023-10-05HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS
#7 | 2023-09-28PACKAGE LAYERS FOR STRESS MONITORING AND METHOD
#8 | 2022-09-08Snap button fastener providing electrical connection
#9 | 2021-09-30WLCSP reliability improvement for package edges including package shielding
#10 | 2021-02-11Snap button fastener providing electrical connection
#11 | 2019-12-26Snap button fastener providing electrical connection
#12 | 2018-08-02Low thermal resistance hanging die package
#13 | 2018-05-31WEARABLE COMPUTING DEVICE
#14 | 2017-08-24Snap button fastener providing electrical connection
#15 | 2016-08-04Wearable computing device
#16 | 2016-06-23Snap button fastener providing electrical connection
#17 | 2014-07-17Semiconductor device with chip having low-k-layers
836952 ⎘