Wolfram Hable

AN ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE DISPOSED ON AN INTERPOSER LAYER

Fluid-cooled package having shielding layer

Electronic module including a semiconductor package connected to a fluid heatsink

Molded package with chip carrier comprising brazed electrically conductive layers

Molded package with chip carrier comprising brazed electrically conductive layers

Package with vertically spaced partially encapsulated contact structures

Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet

Package cooled with cooling fluid and comprising shielding layer

Package with partially encapsulated cooling channel for cooling an encapsulated chip

Semiconductor chip package comprising laterally extending connectors

Electronic module and method of manufacturing the same

Electronic module comprising fluid cooling channel and method of manufacturing the same

Electronic module and method of manufacturing the same

Substrate, chip arrangement, and method for manufacturing the same

Power module comprising two substrates and method of manufacturing the same

Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip

Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit

MULTI-CHIP PACKAGE

Power module having at least two substrates

Power module comprising at least two substrates and method for producing the same