Saal
Germany
9
2022-12-29
The entities that hold a legal rights for patent applications filed by inventor Ledutke Michael:
Michael Ledutke from Saal, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor packages including recesses to contain solder
#2 | 2022-12-29SEMICONDUCTOR MODULE WITH SHAPED EXTERNAL CONTACT FOR REDUCED CRACK FORMATION IN THE ENCAPSULATION BODY
#3 | 2020-02-06Semiconductor module
#4 | 2019-03-07Methods for producing packaged semiconductor devices
#5 | 2018-05-03Package with vertically spaced partially encapsulated contact structures
#6 | 2018-01-25Method for producing a semiconductor module
#7 | 2017-09-14Method for manufacturing an arrangement including a chip carrier notch
#8 | 2014-10-16Arrangement having a plurality of chips and a chip carrier, and a processing arrangement
#9 | 2014-07-31Semiconductor devices and methods of producing these
851277 ⎘