Milpitas, California
United States
9
2015-11-26
The entities that hold a legal rights for patent applications filed by inventor Chew Soon Ing:
Soon Ing Chew from Milpitas, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor device package having asymmetric chip mounting area and lead widths
#2 | 2015-02-19Semiconductor package having a baseplate with a die attach region and a peripheral region
#3 | 2013-10-03PCB based RF-power package window frame
#4 | 2013-02-14Flange for semiconductor die
#5 | 2011-06-23Flange for semiconductor die
#6 | 2011-04-21Open cavity leadless surface mountable package for high power RF applications
#7 | 2011-01-20Air cavity package with copper heat sink and ceramic window frame
#8 | 2010-11-11High power ceramic on copper package
#9 | 2010-06-17Thermally enhanced electronic package
85318 ⎘