Tokyo
Japan
35
2023-01-19
The entities that hold a legal rights for patent applications filed by inventor HAYASHI Eiji:
Eiji HAYASHI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD FOR PRODUCING CELL-CONTAINING EXTRACELLULAR MATRIX, CELL CULTURE METHOD, DEVICE FOR PRODUCING CELL-CONTAINING EXTRACELLULAR MATRIX AND CONTROL PROGRAM
#2 | 2021-05-13AGGREGATED CELL MASS DISPERSING DEVICE AND METHOD OF DISPERSING AGGREGATED CELL MASS
#3 | 2019-07-18Semiconductor device and method of manufacturing the same
#4 | 2018-03-08Semiconductor device and method of manufacturing the same
#5 | 2017-04-27Semiconductor device
#6 | 2016-12-08Semiconductor device and method of manufacturing the same
#7 | 2016-07-07Semiconductor device and method of manufacturing the same
#8 | 2015-04-09Semiconductor device and method of manufacturing
#9 | 2014-11-06Semiconductor device and method of manufacturing the same
#10 | 2014-08-14LIQUID CRYSTAL DISPLAY AND METHOD FOR PRODUCING LIQUID CRYSTAL DISPLAY
#11 | 2014-02-06Semiconductor device and method of manufacturing the same
#12 | 2013-09-05Semiconductor device and method of manufacturing the same
#13 | 2013-02-14Semiconductor device and method of manufacturing the same
#14 | 2012-05-31Semiconductor device and method of manufacturing the same
#15 | 2012-01-19COMPOSITION FOR FORMING LIQUID CRYSTAL ALIGNMENT FILM AND LIQUID CRYSTAL DISPLAY DEVICE
#16 | 2011-11-03SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#17 | 2011-07-07Semiconductor device having elastic solder bump to prevent disconnection
#18 | 2011-05-19Liquid crystal aligning agent, method of producing a liquid crystal alignment film and liquid crystal display device
#19 | 2011-03-24Liquid crystal aligning agent, method of producing a liquid crystal alignment film and liquid crystal display device
#20 | 2011-02-24Liquid crystal aligning agent, liquid crystal alignment film and liquid crystal display device
#21 | 2010-10-07Semiconductor device having elastic solder bump to prevent disconnection
#22 | 2010-07-29Semiconductor device and method of manufacturing the same
#23 | 2009-07-09Semiconductor device and method of manufacturing the same
#24 | 2009-03-19Manufacturing method of semiconductor device with a mold resin having a mold release agent
#25 | 2008-06-05Semiconductor device having elastic solder bump to prevent disconnection
#26 | 2007-11-20Insulation film
#27 | 2007-08-23Manufacturing method of semiconductor device
#28 | 2007-07-05STOPPER FOR CHEMICAL MECHANICAL PLANARIZATION, METHOD FOR MANUFACTURING SAME, AND CHEMICAL MECHANICAL PLANARIZATION METHOD
#29 | 2007-03-13Stopper for chemical mechanical planarization, method for manufacturing same, and chemical mechanical planarization method
#30 | 2006-11-02Semiconductor device and method of manufacturing the same
#31 | 2006-06-22Numerical control apparatus and numerical control system
#32 | 2005-08-04Solder alloy and semiconductor device
#33 | 2005-06-28System for developing an application system and implementing thereof
#34 | 2005-03-17Client server system, information processing apparatus and control method therefor, and program for executing the control method
#35 | 2005-03-01Control parameter automatic adjustment apparatus
85350 ⎘