Phoenix, Arizona
United States
12
2025-01-16
The entities that hold a legal rights for patent applications filed by inventor Stender Matthias:
Matthias Stender from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Tungsten Chemical Mechanical Polishing Slurries
#2 | 2024-12-05Triazole- And/Or Triazolium-Based Polymers And Copolymers As Additives For Chemical Mechanical Planarization Slurries
#3 | 2024-08-08Phosphonium Based Polymers And Copolymers As Additives For Chemical Mechanical Planarization Slurries
#4 | 2024-07-25IMIDAZOLIUM-BASED POLY(IONIC LIQUID)S AND USE THEREFORE
#5 | 2021-11-04Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography
#6 | 2020-02-06Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography
#7 | 2020-01-23Tungsten chemical mechanical polishing for reduced oxide erosion
#8 | 2018-01-04Additives for barrier chemical mechanical planarization
#9 | 2017-03-30Stop-on silicon containing layer additive
#10 | 2016-08-18Dishing reducing in tungsten chemical mechanical polishing
#11 | 2014-11-06Tellurium compounds useful for deposition of tellurium containing materials
#12 | 2014-08-07Antimony and germanium complexes useful for CVD/ALD of metal thin films
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