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Inventor profile of:

Do Jae Yoo

City:

Suwon-Si

Country:

South Korea

Published Applications:

31

Last publication date:

2025-12-25

Top Assignees for applications by Do Jae Yoo

The entities that hold a legal rights for patent applications filed by inventor Yoo Do Jae:

Recent patent applications by Yoo Do Jae

Do Jae Yoo from Suwon-Si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-12-25
US20250393132A1
Electricity

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

 #2 | 2024-10-31
US20240365475A1
Electricity

REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME

 #3 | 2024-02-29
US20240074065A1
Electricity

Reprint apparatus for circuit board and reprint method using the same

 #4 | 2024-01-25
US20240032201A1
Electricity

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

 #5 | 2020-12-17
US20200395396A1
Electricity

IMAGE SENSOR PACKAGE

 #6 | 2020-11-05
US20200350351A1
Electricity

Image sensor package including reflector

 #7 | 2018-04-19
US20180110147A1
Electricity

Manufacturing method of an electronic component module

 #8 | 2017-10-19
US20170301632A1
Electricity

PACKAGE AND METHOD OF MANUFACTURING THE SAME

 #9 | 2017-08-03
US20170221835A1
Electricity

Double-sided package module and substrate strip

 #10 | 2017-01-19
US20170018513A1
Electricity

SEMICONDUCTOR PACKAGE INCLUDING AN ANTENNA FORMED IN A GROOVE WITHIN A SEALING ELEMENT

 #11 | 2016-10-27
US20160315027A1
Electricity

Semiconductor package with improved signal stability and method of manufacturing the same

 #12 | 2016-05-05
US20160126200A1
Electricity

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED ANTENNA FOR WIRELESS APPLICATIONS

 #13 | 2016-02-04
US20160035678A1
Electricity

Package and method of manufacturing the same

 #14 | 2016-01-21
US20160021737A1
Electricity

ELECTRIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME

 #15 | 2016-01-21
US20160020171A1
Electricity

Semiconductor package and method of manufacturing the same

 #16 | 2016-01-07
US20160007463A1
Electricity

Electronic device module and method of manufacturing the same

 #17 | 2015-10-08
US20150289392A1
Electricity

Electronic device module and manufacturing method thereof

 #18 | 2015-08-13
US20150228625A1
Electricity

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

 #19 | 2015-08-06
US20150223361A1
Electricity

Electronic component module and manufacturing method thereof

 #20 | 2015-06-25
US20150181708A1
Electricity

SEMICONDUCTOR PACKAGE MODULE

 #21 | 2015-05-21
US20150137339A1
Electricity

Semiconductor package and method of manufacturing the same

 #22 | 2015-05-21
US20150136451A1
Electricity

ELECTRONIC COMPONENT MODULE

 #23 | 2015-05-14
US20150131235A1
Electricity

Electronic component module and manufacturing method thereof

 #24 | 2015-05-14
US20150131231A1
Electricity

ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF

 #25 | 2015-04-30
US20150115443A1
Electricity

SEMICONDUCTOR PACKAGE

 #26 | 2015-04-02
US20150091146A1
Electricity

POWER SEMICONDUCTOR PACKAGE

 #27 | 2015-03-05
US20150062829A1
Electricity

Electronic device module and manufacturing method thereof

 #28 | 2015-02-26
US20150054173A1
Electricity

SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND STACK TYPE SEMICONDUCTOR PACKAGE

 #29 | 2014-08-07
US20140220743A1
Electricity

POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

 #30 | 2011-12-08
US20110298103A1
Electricity

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

 #31 | 2011-12-08
US20110298102A1
Electricity

Semiconductor package with a conductive shielding member
InventorID:

863383 ⎘