Osaka
Japan
8
2019-07-25
The entities that hold a legal rights for patent applications filed by inventor MURATA Junji:
Junji MURATA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Flattening method and flattening apparatus
#2 | 2015-03-12POLISHING METHOD, POLISHING APPARATUS AND POLISHING TOOL
#3 | 2014-08-21Flattening method and flattening apparatus
#4 | 2012-09-27Polishing method, polishing apparatus and polishing tool
#5 | 2012-01-05Polishing method, polishing apparatus and GaN wafer
#6 | 2010-06-17CATALYST-AIDED CHEMICAL PROCESSING METHOD AND APPARATUS
#7 | 2009-04-16Flattening method and flattening apparatus
#8 | 2008-03-27Catalyst-aided chemical processing method and apparatus
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