Anwar Husain

Plasma resistant arc preventative coatings for manufacturing equipment components

REPLACEABLE ELECTROSTATIC CHUCK OUTER RING FOR EDGE ARCING MITIGATION

Helical plug for reduction or prevention of arcing in a substrate support

Temperature controlled secondary electrode for ion control at substrate edge

EDGE RING ASSEMBLY FOR A SUBSTRATE SUPPORT IN A PLASMA PROCESSING CHAMBER

APPARATUS FOR REDUCTION OR PREVENTION OF ARCING IN A SUBSTRATE SUPPORT

Methods and apparatus for dechucking wafers

Electrostatic chuck assembly having a dielectric filler

Edge ring assembly for a substrate support in a plasma processing chamber

METHOD TO MODULATE THE WAFER EDGE SHEATH IN A PLASMA PROCESSING CHAMBER

Electrostatic chuck assembly having a dielectric filler

ION IMPLANTER AND METHOD FOR ION IMPLANTATION

METHOD AND ION IMPLANTER FOR LOW TEMPERATURE IMPLANTATION

Plasma processing chamber with a grounded electrode assembly

Methods for Confinement of Foam Delivered by a Proximity Head

Method for using generator for foam to clean substrate

Wafer carrier drive apparatus and method for operating the same

Confinement of foam delivered by a proximity head

Generator for foam to clean substrate

Single substrate processing head for particle removal using low viscosity fluid

SEMICONDUCTOR SUBSTRATE CLEANING SYSTEM

Apparatus for an optimized plasma chamber grounded electrode assembly

Spin-rinse-dryer

Semiconductor substrate cleaning system