Santa Clara, California
United States
63
2019-10-10
The entities that hold a legal rights for patent applications filed by inventor Terrill Kyle:
Kyle Terrill from Santa Clara, US has applied for patents for these inventions. The list has both pending applications and granted patents:
High-electron-mobility transistor with buried interconnect
#2 | 2019-08-01Trench MOSFET with self-aligned body contact with spacer
#3 | 2019-06-27High-electron-mobility transistor devices
#4 | 2018-08-16Current limiting systems and methods
#5 | 2018-07-26Transistor structure with improved unclamped inductive switching immunity
#6 | 2018-06-07High-electron-mobility transistor with buried interconnect
#7 | 2018-06-07High-electron-mobility transistor devices
#8 | 2017-10-12Semiconductor device having multiple gate pads
#9 | 2017-09-21Semiconductor device with non-uniform trench oxide layer
#10 | 2017-06-08Method for fabricating stack die package
#11 | 2017-04-27MOSFET active area and edge termination area charge balance
#12 | 2017-04-20Trench MOSFET with self-aligned body contact with spacer
#13 | 2017-04-13Structures and methods of fabricating dual gate devices
#14 | 2017-01-26Semiconductor device with trench-like feed-throughs
#15 | 2017-01-12Semiconductor device with non-uniform trench oxide layer
#16 | 2016-12-08Split gate semiconductor device with curved gate oxide profile
#17 | 2016-08-04System and method for substrate wafer back side and edge cross section seals
#18 | 2016-07-28Transistor structure with improved unclamped inductive switching immunity
#19 | 2016-02-25Transistor structure with improved unclamped inductive switching immunity
#20 | 2015-08-27Transistor structure with feed-through source-to-substrate contact
#21 | 2015-07-09MOSFET termination trench
#22 | 2015-04-23SEMICONDUCTOR STRUCTURE WITH HIGH ENERGY DOPANT IMPLANTATION
#23 | 2014-09-18Method for fabricating stack die package
#24 | 2014-09-18Stack die package
#25 | 2014-08-21Trench metal oxide semiconductor with recessed trench material and remote contacts
#26 | 2014-04-10Transistor structure with feed-through source-to-substrate contact
#27 | 2013-11-12Electrostatic discharge protection circuit for integrated circuits
#28 | 2013-10-24Current limiting systems and methods
#29 | 2013-08-15MOSFET termination trench
#30 | 2013-02-14Power MOSFET contact metallization
#31 | 2012-11-22Semiconductor device having reduced gate charges and superior figure of merit
#32 | 2012-08-30METHOD OF FORMING A HYBRID SPLIT GATE SIMICONDUCTOR
#33 | 2012-08-23HYBRID SPLIT GATE SEMICONDUCTOR
#34 | 2012-03-22Trench polysilicon diode
#35 | 2011-12-06Trench polysilicon diode
#36 | 2011-11-03Transistor structure with feed-through source-to-substrate contact
#37 | 2011-10-20Structures and methods of fabricating dual gate devices
#38 | 2011-09-01Structures of and methods of fabricating split gate MIS devices
#39 | 2011-08-18Power switch with active snubber
#40 | 2011-05-05Semiconductor device with trench-like feed-throughs
#41 | 2011-04-21Super-high density trench MOSFET
#42 | 2011-04-21Split gate semiconductor device with curved gate oxide profile
#43 | 2011-03-03Super junction trench power MOSFET device fabrication
#44 | 2011-03-03System and method for substrate wafer back side and edge cross section seals
#45 | 2011-03-03Super junction trench power MOSFET devices
#46 | 2010-01-28Method of fabricating super trench MOSFET including buried source electrode
#47 | 2009-09-01Electrostatic discharge protection circuit for integrated circuits
#48 | 2009-04-09MOSFET active area and edge termination area charge balance
#49 | 2008-10-23Trench metal oxide semiconductor with recessed trench material and remote contacts
#50 | 2008-07-31Method of fabricating super trench MOSFET including buried source electrode
#51 | 2008-07-03Ultra-low drain-source resistance power MOSFET
#52 | 2008-06-12Trench polysilicon diode
#53 | 2007-12-13Power MOSFET contact metallization
#54 | 2007-09-27Ultra-low drain-source resistance power MOSFET
#55 | 2007-08-16Super trench MOSFET including buried source electrode
#56 | 2007-06-28Trench polysilicon diode
#57 | 2006-03-14Self-aligned differential oxidation in trenches by ion implantation
#58 | 2005-11-03Super trench MOSFET including buried source electrode and method of fabricating the same
#59 | 2005-07-26Method for making trench MIS device with reduced gate-to-drain capacitance
#60 | 2005-06-07Trench MIS device with graduated gate oxide layer
#61 | 2005-04-19Trench MIS device with reduced gate-to-drain capacitance
#62 | 2005-04-05Method of fabricating trench MIS device with graduated gate oxide layer
#63 | 2005-02-01Trench MIS device with active trench corners and thick bottom oxide
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