Baldham
Germany
11
2014-10-02
The entities that hold a legal rights for patent applications filed by inventor Hübner Holger:
Holger Hübner from Baldham, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Connecting element for a multi-chip module and multi-chip module
#2 | 2008-06-24Device and method for soldering contacts on semiconductor chips
#3 | 2007-09-06Method for diffusion soldering
#4 | 2006-12-14Protected chip stack
#5 | 2006-03-16Method for producing chip stacks
#6 | 2006-01-05Semiconductor chip stack
#7 | 2005-08-16Electronic component including a housing and a substrate
#8 | 2005-07-12Method for contact-connecting an electrical component to a substrate having a conductor structure
#9 | 2005-06-14Semiconductor component having a material reinforced contact area
#10 | 2005-06-09Component
#11 | 2005-03-29Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agent
916762 ⎘