Gilbert, Arizona
United States
3
2014-11-06
The entities that hold a legal rights for patent applications filed by inventor Zarbock Edward:
Edward Zarbock from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:
DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER SUBSTRATES INCLUDING EMBEDDED-DICE, AND PROCESSES OF FORMING SAME
#2 | 2014-10-02Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same
#3 | 2012-03-29Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same
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