Hirohiko Kozai

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2020-10-22

Top Assignees for applications by Hirohiko Kozai

The entities that hold a legal rights for patent applications filed by inventor Kozai Hirohiko:

Hirohiko Kozai from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Inspecting apparatus and processing apparatus including the same

Method of processing bonded wafer

Wafer processing method for removing organic debris

Cutting apparatus

InventorID:

925989 ⎘