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Inventor profile of:

Shingo YASUDA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2026-06-04

Top Assignees for applications by Shingo YASUDA

The entities that hold a legal rights for patent applications filed by inventor YASUDA Shingo:

Ebara Corporation 6 Tokyo, Japan
NATIONAL INSTITUTE OF INFORMATION AND COMMUNICATIONS TECHNOLOGY 1 Tokyo, Japan
TDK CORPORATION 1 Tokyo, Japan
KONAMI CORPORATION 1 Tokyo, Japan
NEC Corporation 1 Tokyo, Japan

Recent patent applications by YASUDA Shingo

Shingo YASUDA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-06-04

US20260157208A1

Electricity

PLATING APPARATUS AND PLATING METHOD

#2 | 2024-02-15

US20240054213A1

Physics

ATTACK INFORMATION GENERATION APPARATUS, CONTROL METHOD, AND NON-TRANSITORY COMPUTER READABLE MEDIUM

#3 | 2022-09-22

US20220301749A1

Electricity

NTC thermistor element

#4 | 2022-07-21

US20220228285A1

Chemistry; metallurgy

Plating method, insoluble anode for plating, and plating apparatus

#5 | 2021-06-03

US20210164125A1

Chemistry; metallurgy

Plating method and plating apparatus

#6 | 2019-08-01

US20190233967A1

Chemistry; metallurgy

Plating method and plating apparatus

#7 | 2015-07-23

US20150203983A1

Chemistry; metallurgy

Plating method and plating apparatus

#8 | 2014-10-09

US20140299476A1

Electricity

ELECTROPLATING METHOD

#9 | 2012-10-11

US20120255864A1

Chemistry; metallurgy

ELECTROPLATING METHOD

#10 | 2012-06-21

US20120152749A1

Chemistry; metallurgy

Electroplating method

#11 | 2012-06-14

US20120145552A1

Chemistry; metallurgy

ELECTROPLATING METHOD

#12 | 2006-01-19

US20060012117A1

Physics

Random number selector, and bingo game machine incorporating the same

InventorID:

926620 ⎘