Andreas Grassmann

Leadframe, Encapsulated Package with Punched Lead and Sawn Side Flanks, and Corresponding Manufacturing Method

Power Module with Semiconductor Packages Mounted on Metal Frame

Power semiconductor package having first and second lead frames

MOLDED POWER SEMICONDUCTOR PACKAGE

Semiconductor Device Module Comprising Flexible Leads for the Purpose of Height Adjustment

Power module with semiconductor packages mounted on metal frame

Method and device for producing a housing

Semiconductor package with barrier to contain thermal interface material

DOUBLE SIDED COOLING MODULE WITH POWER TRANSISTOR SUBMODULES

Package with encapsulated electronic component between laminate and thermally conductive carrier

Fluid-cooled package having shielding layer

Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method

Batch manufacture of packages by sheet separated into carriers after mounting of electronic components

Semiconductor panels, semiconductor packages, and methods for manufacturing thereof

Power semiconductor module and method for producing a power semiconductor module

Package comprising chip contact element of two different electrically conductive materials

COOLING TECHNIQUES FOR SEMICONDUCTOR PACKAGE

Cooling techniques for semiconductor package

Package with interconnections having different melting temperatures

Semiconductor module cooling system

Package with interconnections having different melting temperatures

Package with vertically spaced partially encapsulated contact structures

Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet

Chip carrier configured for delamination-free encapsulation and stable sintering

Package cooled with cooling fluid and comprising shielding layer

Package with roughened encapsulated surface for promoting adhesion

Package with partially encapsulated cooling channel for cooling an encapsulated chip

Electronic sub-module including a leadframe and a semiconductor chip disposed on the leadframe

Electronic module and method of manufacturing the same

Method of manufacturing a cooler for semiconductor modules

INVERTER WITH THERMAL CONDUCTIVITY INTERFACE MATERIAL AND HYBRID VEHICLE TO WHICH THE SAME IS APPLIED

POWER SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME

Printed circuit board including a leadframe with inserted packaged semiconductor chips

Plastic cooler for semiconductor modules

Power semiconductor module with current sensor

Electronic switching element and integrated sensor

Electronic module and method of manufacturing the same

Substrate, chip arrangement, and method for manufacturing the same

Power module comprising two substrates and method of manufacturing the same

Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip