Inventor profile of:

Tom Choi

City:

Sunnyvale, California

Country:

United States

Published Applications:

17

Last publication date:

2025-11-20

Top Assignees for applications by Tom Choi

The entities that hold a legal rights for patent applications filed by inventor Choi Tom:

Recent patent applications by Choi Tom

Tom Choi from Sunnyvale, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-11-20
US20250357117A1
Electricity

DOPED TUNGSTEN CARBIDE LOW-K ETCH HARD MASK

#2 | 2022-04-28
US20220130722A1
Electricity

MULTI COLOR STACK FOR SELF ALIGNED DUAL PATTERN FORMATION FOR MULTI PURPOSE DEVICE STRUCTURES

#3 | 2020-05-28
US20200168463A1
Electricity

Selective removal of silicon-containing materials

#4 | 2020-02-06
US20200043734A1
Electricity

SYSTEMS AND METHODS FOR MATERIAL BREAKTHROUGH

#5 | 2019-10-10
US20190311900A1
Electricity

Systems and methods for material breakthrough

#6 | 2019-04-25
US20190122902A1
Electricity

Atomic layer etching processes

#7 | 2019-01-17
US20190019690A1
Electricity

Non-halogen etching of silicon-containing materials

#8 | 2018-11-08
US20180323075A1
Electricity

SiN spacer profile patterning

#9 | 2018-08-09
US20180226259A1
Electricity

Shaped etch profile with oxidation

#10 | 2018-05-17
US20180138049A1
Electricity

SiN spacer profile patterning

#11 | 2018-03-15
US20180076083A1
Electricity

Footing removal for nitride spacer

#12 | 2018-03-15
US20180076044A1
Electricity

Poly directional etch by oxidation

#13 | 2017-08-24
US20170243754A1
Electricity

Cyclic oxide spacer etch process

#14 | 2016-10-20
US20160307772A1
Electricity

SPACER FORMATION PROCESS WITH FLAT TOP PROFILE

#15 | 2016-10-06
US20160293438A1
Electricity

Cyclic spacer etching process with improved profile control

#16 | 2016-10-06
US20160293437A1
Electricity

Cyclic spacer etching process with improved profile control

#17 | 2014-11-13
US20140335697A1
Electricity

Pulsed dielectric etch process for in-situ metal hard mask shape control to enable void-free metallization

InventorID:

968302 ⎘