Eon Soo JANG

City:

Suwon-si

Country:

South Korea

Published Applications:

Last publication date:

2016-12-22

Top Assignees for applications by Eon Soo JANG

The entities that hold a legal rights for patent applications filed by inventor JANG Eon Soo:

Eon Soo JANG from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Package substrate and semiconductor package including the same

Semiconductor package including heat spreader and method for manufacturing the same

Semiconductor packages including upper and lower packages and heat dissipation parts

Package-on-package device

Semiconductor packages including heat exhaust part

Semiconductor package device

InventorID:

972764 ⎘