Fishkill, New York
United States
19
2015-10-08
The entities that hold a legal rights for patent applications filed by inventor Hoinkis Mark:
Mark Hoinkis from Fishkill, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Methods for etching a metal layer to form an interconnection structure for semiconductor applications
#2 | 2015-01-15Selective sputtering for pattern transfer
#3 | 2014-11-27Copper residue chamber clean
#4 | 2014-09-18Subtractive plasma etching of a blanket layer of metal or metal alloy
#5 | 2008-09-04Method and apparatus of stress relief in semiconductor structures
#6 | 2008-05-06Method and apparatus of stress relief in semiconductor structures
#7 | 2007-07-10Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer
#8 | 2007-03-15Post-etch removal of fluorocarbon-based residues from a hybrid dielectric structure
#9 | 2006-12-28Back end interconnect with a shaped interface
#10 | 2006-06-13Reduction of the shear stress in copper via's in organic interlayer dielectric material
#11 | 2006-06-01Bilayered metal hardmasks for use in dual damascene etch schemes
#12 | 2006-05-30Bilayered metal hardmasks for use in Dual Damascene etch schemes
#13 | 2005-10-06Method and apparatus of stress relief in semiconductor structures
#14 | 2005-09-22OXIDIZED TANTALUM NITRIDE AS AN IMPROVED HARDMASK IN DUAL-DAMASCENE PROCESSING
#15 | 2005-06-02Device interconnection
#16 | 2005-05-26Back end interconnect with a shaped interface
#17 | 2005-05-26Crystallographic modification of hard mask properties
#18 | 2005-04-14Dual damascene structure and method
#19 | 2005-03-22Device interconnection
979227 ⎘