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Inventor profile of:

Changfeng Xia

City:

Jiangsu

Country:

China

Published Applications:

7

Last publication date:

2022-12-01

Top Assignees for applications by Changfeng Xia

The entities that hold a legal rights for patent applications filed by inventor Xia Changfeng:

  • CSMC TECHNOLOGIES FAB1 CO., LTD. 4 Jiangsu, China
  • CSMC TECHNOLOGIES FAB2 CO., LTD. 1 Jiangsu, China
  • CSMC Technologies Fabi Co., Ltd. 1 Jiangsu, China

Recent patent applications by Xia Changfeng

Changfeng Xia from Jiangsu, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-12-01
US20220386052A1
Electricity

MEMS microphone and preparation method therefor

#2 | 2020-07-09
US20200216307A1
Performing operations; transporting

METHOD FOR MANUFACTURING DUAL-CAVITY STRUCTURE, AND DUAL-CAVITY STRUCTURE

#3 | 2017-05-04
US20170121175A1
Performing operations; transporting

Manufacturing method of MEMS chip

#4 | 2015-08-20
US20150233965A1
Physics

Parallel plate capacitor and acceleration sensor comprising same

#5 | 2015-06-25
US20150175409A1
Performing operations; transporting

METHOD FOR FABRICATING MULTI-TRENCH STRUCTURE

#6 | 2015-06-04
US20150151958A1
Performing operations; transporting

MEMS chip and manufacturing method therefor

#7 | 2014-11-27
US20140346647A1
Electricity

Monitoring structure and monitoring method for silicon wet etching depth

InventorID:

980331 ⎘

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