Shanghai
China
11
2026-02-19
The entities that hold a legal rights for patent applications filed by inventor Jiang Weiting:
Weiting Jiang from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE HAVING BIFACIAL SEMICONDUCTOR WAFERS
#2 | 2025-04-24SEMICONDUCTOR WAFER THINNED BY CRACK PROPAGATION
#3 | 2025-03-20STAIR-STEP CONFIGURATION FOR A SEMICONDUCTOR DIE OF AN INTEGRATED CIRCUIT
#4 | 2023-12-21Laser Cutting With Electron Removal
#5 | 2023-11-23DIE SEPARATION RING FOR WAFERS HAVING A LARGE DIE ASPECT RATIO
#6 | 2023-08-17Semiconductor device package with exposed bond wires
#7 | 2023-04-27Semiconductor Device Package Having Improved Conductive Stub Coverage
#8 | 2023-03-30Semiconductor device package mold flow control system and method
#9 | 2018-12-20Heterogeneous fan-out structures for memory devices
#10 | 2016-03-24METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVICES FORMED THEREBY
#11 | 2014-11-27METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVICES FORMED THEREBY
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